? semiconductor components industries, llc, 2012 february, 2012 ? rev. 8 1 publication order number: mbrs360t3/d mbrs360t3g, mbrs360bt3g, NRVBS360T3G, nrvbs360bt3g surface mount schottky power rectifier this device employs the schottky barrier principle in a large area metal ? to ? silicon power diode. state ? of ? the ? art geometry features epitaxial construction with oxide passivation and metal overlay contact. ideally suited for low voltage, high frequency rectification, or as free wheeling and polarity protection diodes, in surface mount applications where compact size and weight are critical to the system. features ? small compact surface mountable package with j ? bend leads ? rectangular package for automated handling ? highly stable oxide passivated junction ? excellent ability to withstand reverse avalanche energy transients ? guard ? ring for stress protection ? nrvbs prefix for automotive and other applications requiring unique site and control change requirements; aec ? q101 qualified and ppap capable ? these are pb ? free devices mechanical characteristics ? case: epoxy, molded, epoxy meets ul 94 v ? 0 ? weight: 217 mg (approximately), smc 95 mg (approximately), smb ? finish: all external surfaces corrosion resistant and terminal leads are readily solderable ? lead and mounting surface temperature for soldering purposes: 260 c max. for 10 seconds ? polarity: notch in plastic body indicates cathode lead ? device meets msl 1 requirements ? esd ratings: ? machine model, c ? human body model, 3b device package shipping ? ordering information smc case 403 schottky barrier rectifiers 3.0 amperes, 60 volts http://onsemi.com ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification brochure, brd8011/d. mbrs360t3g smc (pb ? free) 2,500 / tape & reel b36 = specific device code a = assembly location y = year ww = work week = pb ? free package (note: microdot may be in either location) marking diagrams ayww b36 smb case 403a ayww b36 mbrs360bt3g smb (pb ? free) 2,500 / tape & reel NRVBS360T3G smc (pb ? free) 2,500 / tape & reel 2,500 / tape & reel nrvbs360bt3g smb (pb ? free)
mbrs360t3g, mbrs360bt3g, NRVBS360T3G, nrvbs360bt3g http://onsemi.com 2 maximum ratings rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 60 v average rectified forward current i f(av) 3.0 @ t l = 137 c 4.0 @ t l = 127 c a nonrepetitive peak surge current (surge applied at rated load conditions halfwave, single phase, 60 hz) i fsm 125 a storage temperature range t stg ? 65 to +175 c operating junction temperature (note 1) t j ? 65 to +175 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. 1. the heat generated must be less than the thermal conductivity from junction ? to ? ambient: dp d /dt j < 1/r ja . thermal characteristics characteristic symbol value unit thermal resistance, junction ? to ? lead (note 2) smc package smb package r jl 11 15 c/w thermal resistance, junction ? to ? ambient (note 2) smc package smb package r ja 136 145 c/w thermal resistance, junction ? to ? ambient (note 3) smc package smb package (note 4) r ja 71 73 c/w electrical characteristics maximum instantaneous forward voltage (note 5) (i f = 3.0 a, t j = 25 c) v f 0.740 v maximum instantaneous reverse current (note 5) (rated dc voltage, t j = 25 c) (rated dc voltage, t j = 100 c) i r 0.15 10 ma 2. mounted with minimum recommended pad size, pc board fr4. 3. 1 inch square pad size (1 x 0.5 inch for each lead) on fr4 board. 4. typical value; 1 inch square pad size (1 x 0.5 inch for each lead) on fr4 board. 5. pulse test: pulse width = 300 s, duty cycle 2.0%. v f , instantaneous forward voltage (v) figure 1. typical forward voltage figure 2. maximum forward voltage i f , instantaneous forward current (a) t j = 25 c t j = 150 c t j = 100 c t j = ? 40 c v f , instantaneous forward voltage (v) t j = 25 c t j = 150 c t j = 100 c t j = ? 40 c 0.01 0.1 1 10 0.0 0.2 0.4 0.6 0.8 t j = 175 c 0.01 0.1 1 10 0.0 0.2 0.4 0.6 0.8 i f , instantaneous forward current (a) t j = 175 c
mbrs360t3g, mbrs360bt3g, NRVBS360T3G, nrvbs360bt3g http://onsemi.com 3 v r , instantaneous reverse voltage (v) figure 3. typical reverse current figure 4. maximum reverse current i r , instantaneous reverse current (a) t j = 25 c t j = 150 c t j = 100 c v r , instantaneous reverse voltage (v) i r , instantaneous reverse current (a) t j = 25 c t j = 150 c t j = 100 c 1.0e ? 07 1.0e ? 06 1.0e ? 05 1.0e ? 04 1.0e ? 03 1.0e ? 02 1.0e ? 01 1.0e+00 0 102030405060 t j = 175 c 1.0e ? 06 1.0e ? 05 1.0e ? 04 1.0e ? 03 1.0e ? 02 1.0e ? 01 1.0e+00 0 102030405060 t j = 175 c
mbrs360t3g, mbrs360bt3g, NRVBS360T3G, nrvbs360bt3g http://onsemi.com 4 t l , lead temperature ( c) figure 5. current derating figure 6. forward power dissipation i f(av) , average forward current (a) 0 4 0123 i o , average forward current (a) 2.5 4.5 5 p fo , average power dissipation (w) square wave dc 0.5 1 1.5 2 3 4 r jl = 15 c/w 3.5 2.5 1.5 0.5 square wave dc figure 7. typical capacitance 1000 10 60 0102030 v r , reverse voltage (v) 100 40 50 70 c, capacitance (pf) t j = 25 c 3.5 t j = 175 c 0 1 2 3 4 5 0 20 40 60 80 100 120 140 160 180
mbrs360t3g, mbrs360bt3g, NRVBS360T3G, nrvbs360bt3g http://onsemi.com 5 test type > min pad 1 oz r jc = min pad 1 oz c/w p (pk) t 1 t 2 duty cycle, d = t 1 /t 2 t, time (s) figure 8. thermal response, junction ? to ? ambient, smc package r ( t ) , tran s ient thermal re s p o n s e 100 1 0.1 0.2 d = 0.5 0.05 single pulse 0.1 0.00001 0.0001 0.001 0.01 1 100 1000 0.01 10 0.1 10 test type > min pad 1 oz r jc = min pad 1 oz c/w p (pk) t 1 t 2 duty cycle, d = t 1 /t 2 figure 9. typical thermal response, junction ? to ? ambient, smb package pulse time (s) 0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000 0.01 0.1 1 10 100 r(t) ( c/w) single pulse 50% duty cycle 20% 10% 5% 2% 1%
mbrs360t3g, mbrs360bt3g, NRVBS360T3G, nrvbs360bt3g http://onsemi.com 6 package dimensions smc plastic package case 403 ? 03 issue e dim a min nom max min millimeters 1.90 2.13 2.41 0.075 inches a1 0.05 0.10 0.15 0.002 b 2.92 3.00 3.07 0.115 c 0.15 0.23 0.30 0.006 d 5.59 5.84 6.10 0.220 e 6.60 6.86 7.11 0.260 l 0.76 1.02 1.27 0.030 0.084 0.095 0.004 0.006 0.118 0.121 0.009 0.012 0.230 0.240 0.270 0.280 0.040 0.050 nom max 7.75 7.94 8.13 0.305 0.313 0.320 h e 4.343 0.171 3.810 0.150 2.794 0.110 mm inches scale 4:1 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* e bd c l1 l a1 a notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. d dimension shall be measured within dimension p. 4. 403-01 thru -02 obsolete, new standard 403-03. h e 0.020 ref 0.51 ref l1
mbrs360t3g, mbrs360bt3g, NRVBS360T3G, nrvbs360bt3g http://onsemi.com 7 package dimensions smb case 403a ? 03 issue h e b d c l1 l a a1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. d dimension shall be measured within dimension p. 2.261 0.089 2.743 0.108 2.159 0.085 mm inches scale 8:1 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* dim a min nom max min millimeters 1.90 2.20 2.28 0.075 inches a1 0.05 0.10 0.19 0.002 b 1.96 2.03 2.20 0.077 c 0.15 0.23 0.31 0.006 d 3.30 3.56 3.95 0.130 e 4.06 4.32 4.60 0.160 l 0.76 1.02 1.60 0.030 0.087 0.090 0.004 0.007 0.080 0.087 0.009 0.012 0.140 0.156 0.170 0.181 0.040 0.063 nom max 5.21 5.44 5.60 0.205 0.214 0.220 h e 0.51 ref 0.020 ref d l1 h e polarity indicator optional as needed on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. sc illc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems in tended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scill c and its of ficers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising ou t of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding th e design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resa le in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 mbrs360t3/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loca l sales representative
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